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Project
Flexible electro-photonic integration platform
In this project we combine the expertise of three research groups in respectively photonic integrated circuits, electronic driver circuits and smart optical packaging techniques to realize a flexible platform for electro-photonic integration, for applications in communication, optical interconnects and consumer electronics.
Date:1 Jan 2014 → 31 Oct 2019
Keywords:electronic driver circuits, photonic integrated circuits, optical pachaging techniques
Disciplines:Communications, Applied mathematics in specific fields, Communications technology, Condensed matter physics and nanophysics