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Publication

Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

Journal Contribution - Journal Article

Journal: Materials Today Communications

ISSN: 2352-4928

Volume: 31

Publication year:2022

Institutional Repository URL: https://lirias.kuleuven.be/3701671
DOI: https://doi.org/10.1016/j.mtcomm.2022.103482
WoS Id: 000793291500004

Accessibility:Open