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Publication

Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects

Journal Contribution - Journal Article

Journal: JOURNAL OF LIGHTWAVE TECHNOLOGY

ISSN: 1558-2213

Issue: 8

Volume: 38

Pages: 2360 - 2369

Publication year:2020

WoS Id: 000528521100031
DOI: https://doi.org/10.1109/jlt.2020.2966446
Handle: http://hdl.handle.net/1854/LU-8653490

Accessibility:Open