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Publication
Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects
Journal Contribution - Journal Article
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950
Issue: 9
Volume: 10
Pages: 1542 - 1551
Publication year:2020
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:1
Authors from:Government, Higher Education
Accessibility:Closed