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Publication

High-density interconnect technology assessment of printed circuit boards for space applications

Journal Contribution - Journal Article

Journal: JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING

ISSN: 1551-4897

Issue: 3

Volume: 17

Pages: 79 - 88

Handle: http://hdl.handle.net/1854/LU-8678997
DOI: https://doi.org/10.4071/imaps.1212898

Accessibility:Open