Highly Conductive and Strong CuSn0.3 Alloy Processed via Laser Powder Bed Fusion Starting from a Tin-coated Copper Powder

Despite the high demand, the successful fabrication of fully dense, highly conductive, and strong copper components via laser powder bed fusion (LPBF) is not readily evident. This is mainly due to the low optical absorption of copper, which inhibits the complete melting of copper powders when using commercially available fiber-laser-based LPBF machines. Accordingly, this article proposes a novel approach of using optically absorptive metal-coated copper powders for the fabrication of fully dense, highly conductive, and strong copper components via LPBF. To validate this approach, the surface of the copper powder is modified by applying a very thin (62 ± 14 nm) layer of metallic tin via an immersion plating technique. The application of only a 0.28 wt% of metallic tin coating significantly improved the room temperature powder optical absorption by ∼170% at the fiber laser wavelength. Consequently, crack-free and fully dense copper parts combining high thermal conductivity of 334 ± 4 W/(m·K) and electrical conductivity of 80 ± 1% international annealed copper standard (%IACS) with a good tensile strength of 256 ± 14 MPa, yield strength of 203 ± 4 MPa, and ductility of 21 ± 2 % have been fabricated using a fiber laser with an output laser power of 500 W. Furthermore, the article also describes the negative influence of the presence of a high amount of (0.091 wt%) sulfur, which originates from the organic additives during sub-optimal coating conditions, on the LPBF processing behavior of CuSn alloys. As such, high sulfur-containing tin-coated copper powders do not allow the fabrication of fully dense parts due to the occurrence of solidification cracks and the formation of pores. Subsequently, the optimum tin coating methodology, which limits the amount of sulfur below 0.0025 wt%, is described. The use of sulfur-free powder is recommended for the successful LPBF processing of fully dense parts made of copper and copper alloys.

Publication year:2020

BOF-keylabel:yes

IOF-keylabel:yes

BOF-publication weight:10

CSS-citation score:2

Authors from:Government, Higher Education

Accessibility:Open