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Publication
A Novel Resistance Measurement Methodology for In Situ UBM/Solder Interfacial Reaction Monitoring
Journal Contribution - Journal Article
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950
Issue: 1
Volume: 10
Pages: 30 - 38
Publication year:2020
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:1
Authors from:Government, Higher Education
Accessibility:Closed