< Back to previous page
Publication
Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems
Journal Contribution - Journal Article
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN: 2156-3950
Issue: 9
Volume: 9
Pages: 1815 - 1824
Publication year:2019
BOF-keylabel:yes
IOF-keylabel:yes
BOF-publication weight:1
CSS-citation score:2
Authors from:Government, Higher Education
Accessibility:Open