Publication

Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3

Journal: THIN SOLID FILMS

ISSN: 0040-6090

Volume: 686

Publication year:2019

BOF-keylabel:yes

IOF-keylabel:yes

BOF-publication weight:0.1

CSS-citation score:1

Authors:National

Authors from:Government

Accessibility:Closed