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Publication
Sequential 3D
Book Contribution - Book Chapter Conference Contribution
Subtitle:Key integration challenges and opportunities for advanced semiconductor scaling
In this paper, we review the current progress on 3D sequential device stacking, highlighting the main integration challenges and the possible technological solutions. Next, we explore the potential benefits of 3D sequential stacking at transistor level, CMOS level and for hybrid circuits.
Book: ICICDT 2018 - International Conference on IC Design and Technology, Proceedings
Series: ICICDT 2018 - International Conference on IC Design and Technology, Proceedings
Pages: 145-148
Number of pages: 4
ISBN:9781538625491
Publication year:2018
Keywords:3D sequential, junctionless, silicon-on-insulator, thermal budget, wafer bonding
Authors:International
Accessibility:Closed