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Researcher
Behnam Madadnia
Affiliations
- Department of Electronics and information systems (Department)
Member
From17 Jun 2019 → 24 Sep 2023
Publications
1 - 7 of 7
- A novel method for component positioning in thermoformed electronics(2023)Volume: 546
Authors: Behnam Madadnia, Frederick Bossuyt, Jan Vanfleteren
Pages: 607 - 615 - Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics(2022)
Authors: Behnam Madadnia, Frederick Bossuyt, Jan Vanfleteren
Pages: 6649 - 6663 - Using non-stretchable structures for component positioning in thermoformed electronics(2022)
Authors: Behnam Madadnia, Frederick Bossuyt, Jan Vanfleteren
- Innovative component positioning method for thermoformed electronics(2022)
Authors: Behnam Madadnia, Frederick Bossuyt, Jan Vanfleteren
- Using Grubler's Criterion theory to position the electronic components in thermoformed electronics(2022)
Authors: Behnam Madadnia, Frederick Bossuyt, Jan Vanfleteren
Pages: 233 - 238 - Process optimization of injection overmolding structural electronics with regard to film distortion(2022)
Authors: Martin Hubmann, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur, Thomas Lucyshyn
- Reducing out-of-plane deformation of metal interconnects in structural electronics(2021)
Authors: Behnam Madadnia, Jan Vanfleteren, Frederick Bossuyt
Number of pages: 1