Optimizing aerosol jet® printing of sil-ver interconnections on polyimide film for embedded electronics applications

The Aerosol Jet® Printing (AJP) process is a fine feature sub-micron scale deposition process. The paper discusses the optimization of AJP in order to achieve the desired quality of printed silver ink interconnects on polyimide film for embedded electronics applications. A process window containing the parameters which have influence on the quality aspects of the printed tracks is determined to obtain the optimal quality. Important quality aspects in this research include the geometrical and electrical properties of the printed tracks and also the adhesion of these tracks on the substrate. The geometrical properties are determined by optical image processing and profile analysis. To measure the electrical parameters a micro 4-point probe measuring system is used.

ISBN:978-9949-23-265-9

Publication year:2012