Analysis of texture and residual stresses by means of X-ray diffraction

This project applies for X-ray Diffraction (XRD) equipment, enabling the measurement and quantification of residual stresses and crystallographic texture in polycrystalline materials. Since the presence of stresses and texture influence the static and long-term macroscopic material properties, XRD is an indispensable technique within the field of materials research. It is the most appropriate way to determine stresses and texture parameters in a non-destructive way. Novel research fields where stress and texture determination are required are: the simultaneous prediction of stress and texture during cold deformation processes, the stress and texture development during local solidification during 3D printing of metals, the design of functionally graded materials, etc. An extra advantage of the equipment applied for is the fast detector, simultaneously providing higher resolution measurements.

Keywords:X-ray diffraction

Disciplines:Ceramic and glass materials, Materials science and engineering, Semiconductor materials, Other materials engineering