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Publication

Design and analysis of a novel fine pitch and highly stretchable interconnect

Journal Contribution - Journal Article

Journal: MICROELECTRONICS INTERNATIONAL
ISSN: 1356-5362
Issue: 1
Volume: 27
Pages: 33 - 38
Publication year:2010
BOF-keylabel:yes
IOF-keylabel:yes
CSS-citation score:1
Authors:National
Authors from:Private
Accessibility:Closed