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Publication
Optoelectronics packaging for efficient chip-to-waveguide coupling
Book Contribution - Book Abstract Conference Contribution
Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry. Through the involvement in various European research projects, these concepts are developed in different application domains, including printed circuit board-level optical interconnects (EU-FP7 project FIREFLY), active optical cable assemblies (EU-FP7 project MIRAGE), and artificial optical skin (EU-FP7 project PHOSFOS).
Book: European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts
Number of pages: 1
Publication year:2013